New video cards are coming out furiously and bringing with them new manufacturing processes and better price-to-performance ratios. One of newest memory technologies on the market is HBM (High Bandwidth Memory), introduced on the R9 Fury X. HBM stacks 4 memory dies atop an interposer (packaged on the substrate) to get higher density modules, while also bringing down power consumption and reducing physical transaction distance. HBM is not located on the GPU die itself, but is on the GPU package – much closer than PCB-bound GDDR5/5X memory modules.